BREAK-THROUGH IN HEAT TRANSFER
The MasterAir G100M Heat column technology is a two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. The fluid is transferred by the copper powder filled inside the column creating an anti-gravity heat transfer.
7X LARGER DIAMETER THAN HEATPIPES
Super quick heat transfer is made possible with Heat Column at a massive Ø41.2, the equivalent of 7X the size of traditional heatpipes. The unification of heatpipes and base into one unit captures and efficiently transfers the heat from CPU like never seen before.
LOW PROFILE FOR MINI-ITX BUILDS
The low profile G100M stands at 74.5mm, a great fit for slim PC cases, including mini-ITX cases. Even at these small dimensions, the heatsink has cooling capacity of 130W TDP.
Specifications
Product NameMasterAir G100M
Model numberMAM-G1CN-924PC-R1
CPU SocketIntel® LGA 2066 / 2011-3 / 2011 / 1151 / 1150 / 1155 / 1156 / 1366 / 775 socket
AMD® AM4 / AM3+ / AM3 / AM2+ /AM2 / FM2+ / FM2 / FM1 socket
Dimensions145 x 145 x 74.5 mm (5.7 x 5.7 x 2.9 inch)
Heat Sink Dimensions143 x 143 x 51.7 mm (5.6 x 5.6 x 2.0 inch)
Heat Sink MaterialHeat Column / Aluminum Fins
Heat Sink Weight320g (0.70lb.)
Heat Column DimensionsØ41.2*46.3 mm
Fan Dimensions92 x 92 x 25 mm (3.6 x 3.6 x 1 inch)
Fan Speed600~2400 RPM (PWM) ± 10%
Fan Airflow22.63 CFM ± 10%
Fan Air Pressure1.6 mmH2O ± 10%
Fan MTTF280,000 hrs
LED colorRGB ready
Fan Noise Level (dBA)30 dBA (Max)
Fan Connector4-Pin (PWM)
Fan Rated Voltage12 VDC
Fan Rated Current0.34 A
Fan Safety Current0.37 A
Fan Power Consumption4.08 W
Warranty2 years
EAN Code4719512065341
UPC Code884102037863